Amkor Technology reported record quarterly results, driven by rising demand for AI server chip packaging capacity1. The results landed as semiconductor equities fell roughly 25% from highs and leveraged sector ETFs dropped over 60%, even as underlying capacity demand kept climbing.
GlobalFoundries is expanding U.S. chipmaking capacity backed by a CHIPS Act equity stake and a new federal R&D award2. The funding targets domestic production as data centers and AI servers strain existing supply chains.
Kalray and Bull are jointly developing next-generation high-speed networking for AI and HPC infrastructure, Kalray CEO Éric Baissus said. "As AI continues to redefine infrastructure needs across every sector, we're pleased to offer technologies that deliver greater performance, flexibility and efficiency," Baissus said3. The partnership targets solutions for the next generation of AI and high-performance computing networks.
Skyworks Solutions and Qorvo confirmed leadership for their merged organization. CEO Bob Bruggeworth said the announcement "reflects the strong partnership that has shaped our integration planning efforts from the very beginning"4. The combined company plans to build on both firms' engineering and manufacturing scale.
AMD chief technology officer Mark Papermaster pointed to continued heavy capital investment in AI infrastructure despite the equity sell-off5. Hard demand data across DRAM, packaging, and networking capacity has not turned down, even as investors reprice growth expectations and competitive risk from Chinese AI chip entrants.
Together, the moves show manufacturers still racing to add capacity for data center and AI server demand, a divergence from the sharp semiconductor stock sell-off in late July 2026.